| Filed | Description | |
|---|---|---|
| 1/29/25 | 1.012.03 Material Agreement · New Debt Obligation | → |
| 6/21/21 | 1.012.03 Material Agreement · New Debt Obligation | → |
| 5/5/20 | 1.012.03 Material Agreement · New Debt Obligation | → |
| 3/17/20 | 2.03 New Debt Obligation | → |
| 3/4/19 | 1.012.03 Material Agreement · New Debt Obligation | → |
| 2/25/19 | 1.012.03 Material Agreement · New Debt Obligation | → |
Lam Research Corporation is an American supplier of wafer-fabrication equipment and related services to the semiconductor industry. Its products are used primarily in front-end wafer processing, which involves the steps that create the active components of semiconductor devices and their wiring (interconnects).