| Filed | Description | |
|---|---|---|
| 8/14/25 | 1.011.022.03 Material Agreement · Agreement Terminated · New Debt Obligation | → |
| 7/30/25 | 1.01 Material Agreement | → |
| 12/18/24 | 1.012.03 Material Agreement · New Debt Obligation | → |
| 7/17/24 | 1.012.03 Material Agreement · New Debt Obligation | → |
| 6/18/24 | 1.012.03 Material Agreement · New Debt Obligation | → |
| 5/28/24 | 1.012.03 Material Agreement · New Debt Obligation | → |
| ↓ 10 more | ||
Resideo Technologies, Inc. is an American multinational company that was formed in 2018 out of a spin-off from Honeywell.