| Filed | Description | |
|---|---|---|
| 10/1/25 | 1.01 Material Agreement | → |
| 6/17/25 | 1.012.03 Material Agreement · New Debt Obligation | → |
| 8/2/24 | 1.012.03 Material Agreement · New Debt Obligation | → |
| 5/22/23 | 1.012.03 Material Agreement · New Debt Obligation | → |
| 12/20/21 | 1.012.03 Material Agreement · New Debt Obligation | → |
| 11/8/21 | 1.01 Material Agreement | → |
| ↓ 3 more | ||
Veeco Instruments Inc. , that designs and builds processing systems used in semiconductor and compound semiconductor manufacturing, data storage and scientific markets for applications such as advanced packaging, photonics, power electronics and display technologies.